Arizona State University is at forefront of advanced packaging, the breakthrough microchip technology that combines multiple chips onto a single wafer to make them work faster with powerfully advanced capabilities. A new Center for Advanced Wafer-Level Packaging Applications and Development, created in collaboration with Deca Technologies, will expand domestic semiconductor manufacturing and drive advancements in artificial intelligence, machine learning, automotive electronics and high-performance computing.

0:00 Introduction
0:14 Moore's Law
1:20 Advanced packaging
3:20 Opportunity knocks
4:55 Our strategy
7:24 Just getting started
8:18 The road ahead

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