INTRODUCTION TO FLIP CHIP TECHNOLOGY

Wire Bonding Techniques

DIE ATTACH PROCESS

DIE ATTACH PROCESS (#SHORT)

PACKAGING SEMICONDUCTOR DISCRETE DEVICES

WIRE BONDING (PART 2)

WIRE BONDING (PART 1)

WAFER SAW

Semiconductor Packaging - PACKAGE STRUCTURE

Semiconductor Packaging - ASSEMBLY PROCESS FLOW

Introduction to Semiconductor Packaging